August, 2011 – by Dave Becker, All Flex V.P. Sales & Marketing
Flexible Circuits are proven, reliable interconnect solutions for many of today’s electronic packages. This article gives some general guidelines in terms of “dos” and “don’ts” that will help the engineer or designer make better decisions when using flexible circuitry as an electronic interconnection.
This requires a close working relationship between supplier and customer and is best accomplished with an intimate understanding of the application and customer expectations. Learn about the All Flex continuous improvement program that supplies intensified customer support during initial design and delivery – tailored to a company providing custom engineered products.
Very few circuitry suppliers are good at everything; rather, they tend to develop a specialty. You want your supplier to have a developed capability that dovetails with the requirements of your product .There are five critical considerations to keep in mind during the selection process so you can make an informed decision with confidence.
Dr. Ken Gilleo, PhD
Click here for a complete listing of Dr. Gilleo’s published books, papers, and presentations.
Link: www.et-trends.com – a consulting, advanced package design, and Intellectual Properties firm highlighting emerging technology. Founded by Gilleo in 2003.
Flex is the grand enabler that allows a multitude of products including iPods, flat panel displays, satellites, computers, medical products etc. A fast-paced overview of the fascinating technology that began in 1902 and modern applications.
Product packaging challenges. “The convergence of medicine, electronics, sensor chips, and communications, will bring about a new revolution where technology improves our well-being, safety, and sense of security.” How the medical electronics field is advancing from large massive machines to small portable products.
An exploration of the history of Nanotechnology – an overused term. Nanoscience is new, but the technology is old. Though simple, but useful materials and processes were known to the ancients, future nanotechnology holds great promise.
Uses of nanotechnology – “technology of the small” The status of electronic devices and a look at Nan electronics and where they can lead. Nanomaterials and dielectrics and conductors and the benefits expected by reducing the size.
July 2002 CircuiTree Magazine
Flexible technology continues to lead the way as the unique enabling technology of the past, present, and future. A look back at solderless hard die on flex concepts, and Chip-on-Flex circuits going back to 1960. Why flexible circuitry today is the ideal choice for building a chip carrier with an integrated antenna for RFID and other various applications.
“While the past 50-years have been remarkable, the next 50 will be incredible.” The merging of key technologies will cause a seismic shift in devices that will profoundly affect packaging and printed circuit boards. Electronics will continue to advance, but new materials, designs, architectures, systems and processes will be needed to stay on track.
Concepts, novel designs, new processes and the advancements for injection molded packaging and highlight their impressive attributes; the lowest moisture uptake, the fastest processing, and the highest stability in the world of polymers.
CircuiTree Feature article December 2006
As electronic devices continue to shrink more input/outputs are added creating challenges of connecting devices to circuit boards. This article discusses the possible solutions.
The Sci-fi future of Medicine… The Next 50 Years
Medicine will focus more and more on electronics and emerging technologies, including MEMS (Micro-Electro-Mechanical Systems) and Nanotechnology, while also embracing customized pharmacopeia.
MEMS In Medicine
The rapidly emerging field of BioMEMS and the many applications of these chips including chemical and biological analyzers will be discussed along with the possibility of BioMEMS “medical practitioners” becoming permanent inhabitants of the body.
The New Convergence
The merging of dissimilar fields and the discoveries made at these crossroads of diverse scientific fields. Researchers working on a new technology triad.
Onward and Upward – from Pyramids to Blocks
Pyramid 3D stacking and the competition it will face from the semiconductor industry’s Through -silicon vias (TSV). A discussion of the TSV and its impact on packaging logistics.
24 Hour Quotes
All Flex will provide a quote within 24 hours.
Need help? Request a Design Consultation below.
Download it for free or request a copy.